ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase ...

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

New power-sector training modules added, including turbines and substations. LONDON, UNITED KINGDOM, March 23, 2026 ...

SAN ANTONIO, March 20, 2026--pSemi, a Murata Company, Unveils Breakthrough Power Solutions for Fast Charging Mobile Devices ...

The report authors contend such devices — which are designed to protect firefighters while they work around rooftop solar installations — actually add significant risk by increasing installation ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

The new modules extend Telit Cinterion’s GNSS roadmap from space- and power-constrained IoT devices to applications requiring ...

Microchip Technology has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High ...

Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB ...

Other part numbers will be available for sale sequentially.

Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High ...